Sensors
LTCC multilayer technology is ideal for robust sensor packages or sensor carriers with an integrated 3D-structure. Using the 3D-capabilities of LTCC substrates, specific requirements of sensor elements as well as custom requirements for assembly and packaging can be considered. As a result customized circuit carriers, not only with high complexity but also miniaturized and with integrated functionality, are possible.
Do you have any questions? Your contact person:
Sales:
Kathrin Jöstel
Harald Klaubert
