LTCC Technology Suites Perfect to High Density Interconnection & Harsh Environment

We provide smart solutions in LTCC technology and invite you to discuss your needs with our engineers to create outstanding solutions. Your request receives an individual approach considering the following steps:

LTCC - „Low Temperature Co-Fired Ceramic“

This technology is used in electronic components for enabling high-performance multilayer on ceramic substrates. It offers low signal loss, excellent heat dissipation and high reliability.

LTCC refers to a process with multiple layers of ceramic materials and metal conductors are fired together in a single process, typically between 850-900°C. The metal layers form conductive paths for signals and power, while the ceramic provides insulation and structural support.