In order to bring the latest results of micro system technique to the user in the machine-building industry, a modular system has been developed with the assistance of the Federal Ministry for Education and Research which has already won an excellent reputation in the research landscape under the name of […] weiterlesen …

In order to bring the latest results of micro system technique to the user in the machine-building industry, a modular system has been developed with the assistance of the Federal Ministry for Education and Research which has already won an excellent reputation in the research landscape under the name of MATCH-X Modular Micro Systems. LTCC as a modern casing technology with high functional integratability plays a key role in this new product family for applications in which a high degree of reliability, resistance to excessive heat and thermal shocks are crucial.The individual modules can be linked up with each other directly along the Z-axis or, in a conventional manner, in parallel on the circuit board.<\/p>\n

Extensive investigations are being conducted, addressing the reliability and thermal stability of these systems. A self- sufficient pressure sensor system consisting of a controller module, memory module, and A\/D conversion module was successfully integrated into an existing casing and became fully qualified. Development of further modules and casing types of various functionalities is under way.<\/p>\n

Gepr\u00e4gter Hohlspiegel in LTCC
\nAnodisch bondbarer Wafer
\nGeh\u00e4usetechnik
\nGepr\u00e4gter LTCC f\u00fcr Optosensor
\nHochpoliges LTCC-Geh\u00e4use, 400 Anschl\u00fcsse
\nGepr\u00e4gter Hohlspiegel 5″ Substrat<\/p>\n

MATCH – X Modular Microsystems<\/strong><\/p>\n

\n
• Microsystems through combination of microcircuitry modules<\/li>\n
• Basis for innovative and economical product functionalities<\/li>\n
• Flexible construction of custom-designed systems<\/li>\n<\/ul>\n

  Example pressure sensor<\/strong><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":20,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_genesis_hide_title":false,"_genesis_hide_breadcrumbs":false,"_genesis_hide_singular_image":false,"_genesis_hide_footer_widgets":false,"_genesis_custom_body_class":"","_genesis_custom_post_class":"","_genesis_layout":"","footnotes":""},"class_list":{"0":"post-14223","1":"page","2":"type-page","3":"status-publish","5":"entry"},"_links":{"self":[{"href":"https:\/\/via-electronic.de\/en\/wp-json\/wp\/v2\/pages\/14223","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/via-electronic.de\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/via-electronic.de\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/via-electronic.de\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/via-electronic.de\/en\/wp-json\/wp\/v2\/comments?post=14223"}],"version-history":[{"count":0,"href":"https:\/\/via-electronic.de\/en\/wp-json\/wp\/v2\/pages\/14223\/revisions"}],"wp:attachment":[{"href":"https:\/\/via-electronic.de\/en\/wp-json\/wp\/v2\/media?parent=14223"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}